Ceramic Circuit Board Material

A comprehensive introduction of ceramic pcb as chip components and smt surface mount technology are massively accepted by electronics industry traditional pcbs printed circuit boards with organic laminates as substrate material are developing towards high precision high density and high reliability.

Ceramic circuit board material.

C dcb ceramic board dcb direct copper bonded technology denotes a special process in which the copper foil and the core al2o3 or aln on one or both sides are directly bonded under appropriate high temperature and pressure. Better cte matching and hermetic sealing only add to the appeal of these materials. These circuits are constructed by mixing adhesive lubricant solvent plasticizer and aluminum oxide to create raw ceramics. More for dcb ceramic pcb application of ceramic pcb.

A ceramic circuit board or other mcpcb board has to do with heat transfer. Pcb materials can be classified according to their properties. One of the main reasons why you would avoid fr4 vs. Substrates electronic circuit carriers made from advanced ceramic materials rubalit and alunit engineered by ceramtec have earned a reputation worldwide as the standard materials for electronic circuit carriers and their quality is acknowledged by every brand name manufacturer of hybrid circuits.

A printed circuit board pcb is a board made of different heat resistant insulating materials conductive copper tracks are printed or etched onto this con conductive base substrate. Ceramic circuit boards are actually made of electronic ceramics material and can be made into various shapes. Fr4 pcb material is not. You can use them for high power circuits chip on board modules proximity sensors and more.

Supply high thermal conductivity low expansion ceramic pcb. Ceramic pcbs like aluminum nitride aln and aluminum oxide al203 are extremely thermally conductive. Ceramic circuit boards designed for high temperatures are often referred to as high temperature co fired ceramic htcc circuits. Electronic components are then soldered onto this board making it a printed circuit board assembly.

Ceramic substrates such as alumina aluminum nitride and beryllium oxide are highly thermally conductive materials which transfer heat away from hot spots quickly and efficiently dissipating it over the whole surface.