Ceramic Chip Carrier Package

Chelsea technology j lead chip carrier s feature.

Ceramic chip carrier package.

Ceramic materials facilitate miniaturization through their high strength rigidity and the cavity structures they make possible. 1st 2nd 3rd total seal ring die attach a x b c x d e x. Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition. Lcc trays legacy ltc trays for lcc packages legacy ltc view more.

Various cavity sizes available to acccommodate small medium and large size die. The external lead frame is formed into a j shape to allow for socketing or direct board soldering. Clcc ceramic leadless chip carrier mm inch unit. Leadless smt packages and chip carriers design concept is based on creating an interconnect pattern on a ceramic substrate with pctf plated copper on thick film technology for multiple or.

Commercial quasi hermetic smt package. A leadless chip carrier lcc has no leads but instead has rounded pins through the edges of the ceramic or molded plastic package. Leadless ceramic chip carrier legacy hittite package drawing e ey filter packages by entering lead count or product description into the search box below. Ceramic leaded chip carrier cqfj the ceramic quad flat pack continues to be popular in various surface mount applications.

J lead chip carriers ceramic j lead clip carriers are often used in high heat dissipation applications. Lcc legacy ltc leadless ceramic chip carrier legacy ltc view more. Our inventory of ceramic quad flat packages range in size from 28 to 84 leads. The external lead frame is formed into a j shape to allow.

Plcc plastic leaded p. Mm lead count pkg type or category cavity overall layer thickness ntk material code b black w white connection 0 non conect drawing no. Kyocera provides standard and custom designed ceramic packages optically coated glasses and chip assembly services for ccd and cmos image sensors. Leadless ceramic smt packages and chip carriers with pctf for a direct pcb mount.

Kyocera will exhibit its ceramic packages for mems and sensors at apcot 2016. Package outline material information. Prototypes and devices intended for extended temperature environments are typically packaged in ceramic while high volume products for consumer and commercial markets are typically packaged in plastic. 12 lead lcc 2 9mm x 2 9mm w ep e 12 4 pdf.

Kyocera will present its ceramic packages at elexcon 2016 china s most popular electronics exhibition.