Ceramic Bga Reliability

Typically these are packaged in organic or ceramic ball grid array bga packages which cover a wide range of package input output i o capabilities required for high performance devices.

Ceramic bga reliability.

In addition the utilized ceramic ball grid array cbga. Lower cte may be used to increase reliability. Large number of vias within area of bga increases cte locally. Ceramic ball grid array packaging assembly reliability freescale semiconductor.

Assemblies with water soluble flux were cleaned in an electrovert h500. Type 1 ceramic and plastic bga packages with nearly 300 i os. In addition to alumina al 2 o 3 ceramics we produce aluminum nitride aln with high thermal conductivity 150w mk as well as low temperature co fired ceramic ltcc packages with high 12 3ppm k and low 3. Balls for this package are 90 pb and 10 sn and attached to the ceramic substrate using eutectic 63sn 37pb solder paste.

A small tape based plastic bga package with 280 balls was included in the study 16 x 16 mm 0 8 mm pitch 9 x 9 depopulated center. Ceramic ball grid array package drawings bg accept and proceed. Plastic bga pbga ceramic bga cbga pwb 63sn 37pb eutectic flip chip flip chip bga fcbga column cbga ccga 90pb 10sn high melt i o 600 i o 600. Type 2 ceramic and plastic bga packages with nearly 600 i os.

Substrate based ball grid array bga flip chip bga quad flat leadless stacked chip scale flip chip csp xuejun fan moisture related reliability xuejun fan lamar edu higher performance smaller size cheaper price chip scale and wafer level packaging csp wlp. Incoming pcb requirements for cbga freescale semiconductor. Bga package component reliability after long term storage r. Ceramic plates and printed circuit boards pcb to assess solder wetting.

Shih et al reliability of hitce ceramic bga packages to be published 2005. Also utilized was a 256 leaded and a 256 plastic bga package for evaluating and directly comparing manufacturing robustness and reliability. Flip chip hitce ltcc bga package kyocera provides both ceramic and organic packages for large scale integration lsi devices. Flip chip cbga is a common package for high end microprocessor devices.